AZSA-HS
Overview
The system is linked to the stage of the machine, and the CAD data is superimposed on the machine image. By superimposing the images of the equipment and CAD data, it is possible to process the sample while recognizing the position of the wiring (circuit modification, etc.). It is also possible to carry out emission analysis and EBAC analysis efficiently.
Features
- Seamless Integration: Link CAD data, device stage, and magnification effortlessly, simplifying the process of identifying fault candidates with precision.
- Targeted Defect Isolation: Narrow down defect ranges by efficiently tracing equipotential nodes within the CAD data, enhancing accuracy in defect analysis.
- Optimized Workflow: Reduce the time needed for locating lower layer wiring, processing tasks, and probe positioning by overlaying system images with CAD data, streamlining operations.
- Scalable Data Management: Easily import large-scale data sets, enabling comprehensive analysis of complex structures.
- Versatile Format Compatibility: Benefit from multi-format support, including OASIS, MEBES, JEOL, HL, TOSHIBA, Job Deck, and more, available as an optional feature.
- Enhanced Collaboration: Utilize the data locator function to seamlessly share defect information, luminous point analysis, and processing details, facilitating efficient teamwork and decision-making.
- Advanced Visualization: Access 3D and cross-sectional displays of CAD data, providing deeper insights into the design and structure.
- Optional Circuit Diagram Display: Elevate your analysis with an optional circuit diagram display feature, offering a clearer view of intricate designs.
- Precision Observation: Identify the exact observation position on electron microscope images, even without CAD data, ensuring consistent and accurate analysis across different views.